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Carbon fiber thermal pad
Features
  • The surface is soft and compressible
  • Low thermal resistance
  • Applications at low pressures
  • Good thermal stability
  • Typical Applications
  • base station
  • chip
  • Large servers
  • Data Processing Center
  • 鸿富诚导热垫片HCF-03E 规格书
    HCF-03E Thermal Gap Filler.pdf
    产品参数
    ProjectTechnical indicatorsTesting Standards
    ColorGray-black Visual
    Specifications(mm)120*120ASTM D 5947
    Thickness(mm)0.3~3(±10%)ASTM D 374
    Hardness(Shore 00)65(±10)ASTM D 2240
    Density(g/cc)1.85(±0.5)ASTM D 792
    Resilience(%)>30ASTM D 575
    Oil seepage rate(%)<3HFC
    Operating temperature(℃)-40~125IEC 60068-2-14
    Thermal resistance(°Cin²/W)≤0.04(@40psi/0.3mm)ASTM D 5470


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