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HCF-14  25W
Features
  • The surface is soft and compressible
  • Low thermal resistance
  • Lightweight, high resilience
  • Applications at low pressures
  • Good thermal stability
  • Typical Applications
  • base station
  • chip
  • Large servers
  • Data Processing Center
  • 鸿富诚碳纤维导热垫片 HCF-14 规格书
    HCF-14 Thermal Gap Filler.pdf
    产品参数
    ProjectTechnical indicatorsTesting standards
    ColorGray-blackVisual
    Specifications(mm)120*120ASTM D 5947
    Thickness(mm)0.5~3ASTM D 374
    Hardness(Shore 00)55(±10)ASTM D 2240
    Density(g/cc)2.0(±0.2)ASTM D 792

    Operating temperature(℃)

    -40~125 IECM 60068-2-14

    Thermal conductivityW/mK)

     25.0(±5)
      ASTM D 5470

    Thermal resistance(°Cin²/W )

    ≤0.18(@20psi/2mm)  ASTM D 5470







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