Spring Enlightenment Science and Technology Event, leading the future of the industry with wisdom. From March 26th to 28th, "SEMICON China" &"Munich Shanghai Electronic Equipment Exhibition" was grandly opened at the Shanghai New International Expo Center, bringing together the world's top technologies and solutions for electronic manufacturing.

As an industry vane in the field of electronics manufacturing, this exhibition brings together the world's top companies to showcase cutting-edge technologies and innovative solutions such as intelligent manufacturing, electronic materials, advanced packaging, test and measurement. From precision components to intelligent production lines, from green manufacturing to Industry 4.0, it is not only a stage for technology collision, but also an excellent platform for the upstream and downstream of the industrial chain to seek common development.

As a leading enterprise in the field of thermal interface materials, HFC New Materials brings a new generation of graphene thermal pads, designed for high-power electronic devices (such as 5G base stations, AI servers, new energy vehicle domain control systems), with its excellent performance and wide range of applications, through dynamic demonstration and physical display, vividly presenting the application potential of graphene thermal pads in AI servers, chip advanced packaging, consumer electronics, new energy vehicle electronics, high-power optical modules and other fields, becoming the focus of attention at the exhibition site.

Revolutionary breakthrough: Oriented graphene technology reshapes the boundaries of heat dissipation

Ultra-thin process: ultra-thin thickness, 70% high compression ratio, perfect fit for chip packaging

Extreme thermal conductivity: The orientation process achieves ultra-low thermal resistance of 0.04°Ccm²/W

Deformation adaptation: Patented porous structure absorbs interface warping to ensure long-term reliability

Exhibition direct hit: in-depth analysis of the five innovation dimensions of HFC new materials

In the semiconductor observation interview, Mr. Cao Yong, R&D director of HFC, deeply analyzed the three major technological breakthroughs of the company's graphene thermal conductive pads, and at the same time overcame the problems of mass production process.

Mr. Cao Yong, R&D Director, was interviewed by Semiconductor Watch to comprehensively interpret the core technology breakthroughs

Mr. Cao, R&D director, emphasized that this breakthrough technology, which took three years to develop, not only solves the thermal management pain points of high-power electronic devices, but also promotes the technological upgrading of the entire heat dissipation materials industry. At present, the products have been certified by many leading enterprises in the industry, and have achieved global mass production and supply.

Innovation-driven, helping China's intelligent manufacturing

At this exhibition, HFC's latest research and development of graphene thermal pads broke through the bottleneck of the industry, demonstrating the company's innovation ability in the field of new materials. This achievement vividly interprets the business philosophy of Mr. Sun Aixiang, chairman of the board, of "driven by technological innovation and continuing to break through boundaries in subdivided fields". The company has always focused on the pain points of the industry, created differentiated value for customers through original technology, and promoted industrial upgrading.

Based on the triangular strategy of "material-scenario-technology", HFC has built a three-dimensional development pattern: vertically consolidating the foundation of material research and development, horizontally expanding multiple application scenarios, vertically opening up the high-end technology chain, reshaping the industrial pattern with "intelligent manufacturing in China", and accelerating the global market expansion and innovation ecological co-construction.

HFC thanks you for your support, thank you for every friend who came to HFC's booth to communicate, it is your support that allows us to continue to move forward. We sincerely invite you to continue to pay attention to our dynamics and look forward to meeting you again in the next exhibition.